Basic knowledge of electronic components purchasing -Ameya360 electronic components purchasing website

Trade news

ROHM at PCIM Europe 2025: Powerful Highlights for E-Mobility and Industrial Applications

　　From May 6th to 8th ROHM will exhibit at the PCIM Expo & Conference, the leading international event for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, taking place in Nuremberg. On its booth 304 in hall 9, ROHM will showcase reference projects with renowned partners and present the evolution of its package designs and evaluation boards.　　"PCIM 2025 in Nuremberg is the meeting place for innovation and progress in power electronics. This is where the brightest minds in the industry come together to shape the future of e-mobility and industrial applications. We will be presenting great customer applications to showcase the possibilities offered by our products in the best possible way. Whether in the PV industry or e-mobility sectors – we are involved and would like to talk to our customers on site about the key projects of the future," says Wolfram Harnack, President at ROHM Semiconductor Europe.　　Highlights of ROHM’s presence at PCIM 2025 include:　　For automotive applications, ROHM will exhibit an inverter unit utilizing the TRCDRIVE pack™ that consists of a 2-in-1 SiC Molded Module. Valeo and ROHM have been collaborating since 2022, initially focusing on technical exchange to enhance the performance and efficiency of motor inverters, a key component in the propulsion systems of electric vehicles (EVs) and plug-in hybrids (PHEVs).　　Power solutions for on-board chargers (OBCs), essential for e-mobility applications, will also be on the booth. ROHM will showcase the new EcoSiC™ molded power modules suitable for OBCs, along with OBC applications adopting ROHM’s power semiconductor devices.　　ROHM’s Power Eco Family products: ROHM has grouped the four product lines of power semiconductors under the brand concept “Power Eco Family” and is contributing to the development of a sustainable ecosystem through improved application performance. We will show featured solutions and case studies at the booth.　　In this context, one application example is the new GaN Lineup: ROHM’s EcoGaN™ series of 650V GaN HEMTs in the TOLL package has been adopted for AI server power supplies by Murata Power Solutions, a subsidiary of the Murata Manufacturing Group and a leading supplier of electronic components, batteries and power supplies in Japan. Integrating ROHM’s GaN HEMTs, which combine low loss operation with high-speed switching performance, in Murata Power Solutions’ 5.5kW AI server power supply unit achieves greater efficiency and miniaturization.　　For more information, please refer to AMEYA360’s related news release.　　The details of the Power Eco Family are as follows.　　●　EcoSiC™ is a brand of devices leveraging silicon carbide which is attracting attention in the power device field for performance that surpasses silicon.　　●　EcoGaN™ comprises compact, energy-efficient devices that utilize the low ON resistance, high-speed switching characteristics of GaN to achieve lower application power consumption, smaller peripheral components, and simpler designs requiring fewer parts.　　●　EcoIGBT™ is ROHM’s brand of IGBTs consisting of both devices and modules designed to meet the needs of high-voltage applications in the power device field.　　●　EcoMOS™ is ROHM's brand of silicon power MOSFETs designed for energy-efficient applications in the power device sector.　　During the fair, ROHM’s power experts will participate in several panel discussions and conference presentations. Additionally, they will hold poster sessions at the PCIM Europe 2025 conference.　　More information regarding ROHM’s key highlights at PCIM 2025 is available here: www.rohm.com/pcim　　*EcoSiC™, EcoGaN™, EcoIGBT™, EcoMOS™ and TRCDRIVE pack™ are trademarks or registered trademarks of ROHM Co., Ltd.

Key word：

ROHM

Release time：2025-04-23 17:01 reading：280 Continue reading>>

STMicroelectronics to Invest <span style='color:red'>EU</span>R 5 Billion in New SiC Wafer Fab

Trade news

STMicroelectronics to Invest EUR 5 Billion in New SiC Wafer Fab

　　STMicroelectronics, following its EUR 7.5 billion wafer fab project with GlobalFoundries in Crolles, France. is set to invest EUR 5 billion in building a new SiC super semiconductor wafer fab in Catania, Sicily, Italy. The fab in Italy will specialize in producing SiC chips, a pivotal technology for electric vehicles with substantial growth potential, according to French media L’Usine Nouvelle on November 26th,　　STMicroelectronics competitively plans to transition to 8-inch wafers starting from 2024. The company will integrate Soitec’s SmartSiC technology to enhance efficiency and reduce carbon emissions. Simultaneously, STMicroelectronics aims to increase capacity, achieve internal manufacturing, and collaborate with Chinese firm Sanan Optoelectronics to raise SiC chip-related revenue from the expected USD 1.2 billion in 2023 to USD 5 billion by 2030.　　On June 7th earlier this year, STMicroelectronics and Sanan Optoelectronics announced a joint venture to establish a new 8-inch SiC device fab in Chongqing, China, with an anticipated total investment of USD 3.2 billion.　　To ensure the successful implementation of this extensive investment plan, Sanan Optoelectronics said to utilize its self-developed SiC substrate process to construct and operate a new 8-inch SiC substrate fab independently.　　TrendForce: over 90% SiC market share by major global players　　According to TrendForce, the SiC industry is currently dominated by 6-inch substrates, holding up to 80% market share, while 8-inch substrates only account for 1%. Transitioning to larger 8-inch substrates is a key strategy for further reducing SiC device costs.　　8-inch SiC substrates offer significant cost advantages than 6-inch substrates. The industry’s major players in China, including SEMISiC, Jingsheng Mechanical & Electrical Co., Ltd. (JSG), Summit Crystal, Synlight Semiconductor, KY Semiconductor, and IV-SemiteC, are advancing the development of 8-inch SiC substrates. This shift from the approximately 45% of total production costs associated with substrates is expected to facilitate the broader adoption of SiC devices and create a positive cycle for major companies.　　Not only Chinese companies but also international semiconductor giants like Infineon Technologies and Onsemi are actively vying for a share of the market. Infineon has already prepared the first batch of 8-inch wafer samples in its fab and plans to convert them into electronic samples soon, with mass production applications scheduled before 2030. International device companies like Onsemi and ROHM have also outlined development plans for 8-inch SiC wafers.　　Currently, major companies hold over 90% of the market share, intensifying competition. A slowdown in progress could provide opportunities for followers. According to TrendForce, the market share of the top 5 SiC power semiconductor players in 2022 was dominated by STMicroelectronics (36.5%), Infineon (17.9%), Wolfspeed (16.3%), Onsemi (11.6%), and ROHM (8.1%), leaving the remaining companies with only 9.6%.

Key word：

STMicroelectronics

Release time：2023-11-30 10:53 reading：2559 Continue reading>>

Trade news

ROHM’s New 5-Model Lineup of Low ON Resistance 100V Dual MOSFETs

　　ROHM has developed dual MOSFETs that integrate two 100V chips in a single package - ideal for fan motor drive applied in communication base stations and industrial equipment. New five-models have been added as part of the HP8KEx/HT8KEx (Nch+Nch) and HP8MEx (Nch+Pch) series.　　Recent years have seen a transition to higher voltages from conventional 12V/24V to 48V systems in communication base stations and industrial equipment, - intending to achieve higher efficiency by reducing current values. In these situations, switching MOSFETs are required a withstand voltage of 100V to account for voltage fluctuations, as 48V power supplies are also used in the fan motors for cooling these applications. However, increasing the breakdown voltage raises ON resistance (RDS(on)) (which is in a trade-off relationship), leading to decreased efficiency, making it difficult to achieve both lower RDS(on) and higher breakdown voltage. Moreover, unlike multiple individual drive MOSFETs normally applied in fan motors -　dual MOSFETs that integrate two chips in one package are increasingly being adopted to save space.　　In response, ROHM developed two new series - the HP8KEx/HT8KEx (Nch+Nch) and the HP8MEx (Nch+Pch) - that combine Nch and Pch MOSFET chips using the latest processes. Both series achieve the industry’s lowest RDS(on) by adopting new backside heat dissipation packages with excellent heat dissipation characteristics. As a result, RDS(on) is reduced by up to 56% compared with standard dual MOSFETs (19.6mΩ for the HSOP8 and 57.0mΩ for the HSMT8 Nch+Nch), contributing to significantly lower set power consumption. At the same time, combining two chips in a single package provides greater space savings by reducing area considerably. For example, replacing two single-chip TO-252 MOSFETs with one HSOP8 decreases footprint by 77%.　　Next, ROHM will continue to expand its dual MOSFET lineup to withstand voltages ideal for industrial equipment while also developing low-noise variants. This is expected to contribute to solving social issues such as environmental protection by saving space and reducing power consumption in various applications.　　Application Examples - Fan motors for communication base stations　　- Fan motors for factory automation, and other industrial equipment　　- Fan motors for data center servers, etc.　　Combination with a pre-driver IC to achieve the optimal motor drive solutionCombining these products with ROHM’s market-proven pre-driver ICs for single-/3-phase brushless motors make it possible to consider even smaller motors featuring lower consumption and quieter drive. By providing total support for peripheral circuit design that marries the dual-MOSFET series with pre-driver ICs, ROHM can offer the best motor drive solutions for customer needs.　　Solution examples with 100V Dual MOSFETs　　- HT8KE5 (Nch+Nch Dual MOSFET) + BM64070MUV (3-Phase Brushless Motor Pre-Driver IC)　　- HT8KE6 (Nch+Nch Dual MOSFET) + BM64300MUV (3-Phase Brushless Motor Pre-Driver IC) and more

Key word：

ROHM

Release time：2023-10-19 16:07 reading：2015 Continue reading>>

Trade news

RENESAS RX26T new lineup expansion : Suitable for Motor Control Applications

　　he RX26T group(The New RX26T – Ideal Microcontroller for Motor Control Applications), is poised to be the natural successor to the RX24T/RX24U. This product, designed especially for dual-motor and PFC control, kicked off its mass production in May 2023.　　The RX26T (RAM48KB) variant boasts two package options: 48pin LFQFP and 64pin LFQFP. Additionally, it offers flash memory sizes of 128KB and 256KB.　　　　RX26T Product Lineup　　In recent motor/inverter control applications, there's not only a rising demand for IoT compatibility but also a distinct preference among our customers who have favored RX24T for more specialized, high-performance products. These customers look for solutions that can adeptly handle both single motor with PFC control or dual motor control (2 or 3 shunt controls + a 1 shunt control).　　Catering to demand, the RX26T (RAM48KB) providing 48 and 64-pin packages retains the best of RX24T – from functional to pin layout compatibility – while introducing enhanced features for complex controls. This includes superior arithmetic capabilities, faster A/D conversion feedback, leading to improved control accuracy and efficiency.　　Main improvements include:　　Achieve high arithmetic performance with 120MHz operating frequency, the latest RX CPU core RXv3 (721CoreMark), and 120 MHz no-wait Flash access　　Equip Trigonometric Function Accelerator essential for motor/inverter control, improving the execution cycle number.　　Improve usability and performance of timer and analog functions.　　Protects confidential algorithms from leakage and unauthorized copying partially by Trusted Memory.　　Support the latest communication standard CAN FD.　　Also, when comparing the features of RX24T and RX26T, the table below shows the differences. For more detailed differences, please refer to the application note Differences Between the RX26T Group and the RX24T/RX24U Group that summarizes the differences between the products　　　　Comparison of RX24T and RX26T　　Next, let me introduce the evaluation kit.　　The RX26T (RAM48KB) product aligns seamlessly with Renesas' latest motor solution platform MCK*1, just like the RX26T (RAM64KB) product. We're also rolling out CPU board MCB*2-RX26T Type C that is equipped with the RX26T (RAM48KB) product. Complementing this, we have prepared motor control sample codes tailored for the RX26T (RAM48KB) product. Simply secure your MCK and MCB-RX26T Type C, download the sample codes from our website, and you're all set for an immediate motor-centric evaluation.　　Sensorless Vector Control of a Permanent Magnet Synchronous Motor - For MCK Rev.1.10　　Vector Control for Permanent Magnet Synchronous Motor with Encoder - For MCK Rev.1.10　　In wrapping up, today's spotlight was on the RX26T group's enriched product. This bolstered lineup is our response to the evolving demands of our customers. As you embark on a new motor control application that commands top-tier performance and features, the RX26T group stands ready as your go-to choice.　　*1: Renesas Flexible Motor Control Kit　　*2: Renesas Flexible Motor Control CPU Board

Key word：

RENESAS

Release time：2023-08-31 16:52 reading：3276 Continue reading>>

Trade news

There is news that the new European plant of Taiwan Semiconductor Manufacturing will be delayed by two years as soon as 2025

　　According to the latest report, the industry said that because the automotive semiconductor supply is no longer a serious shortage, and most of the automotive chip customers may switch to Japan, the United States and other new plants production, TSMC's European plant delayed by two years, as soon as 2025 to start construction of the plant.　　At the meeting, TSMC said it was in talks with customers and partners and would evaluate the possibility of setting up specialized fabs in Europe focusing on automotive technology, depending on customer demand and government support. In response to news of the delay in the construction of new plants in Europe, Taiwan Semiconductor said it maintained its previous statement at the legal briefing and had no updated response at this time.　　A team from Taiwan Semiconductor has visited Germany several times over the past two years to assess the feasibility of setting up a 12-inch fab in Germany, with the city of Dresden the most likely location, according to fab tool maker sources.　　In addition, there is also news that Global Crystal's acquisition of German peer World Generation because of the German authorities because of "too little time to review", causing a ripple effect. Sources said that the original said to set up a plant in Germany is still in the "very, very early stage", it is feared that due to Global crystal acquisition of World Tron failed, the new European plant will turn to evaluate the Czech Republic.　　Industry insiders pointed out that in the previous automotive chip shortage, TSMC not only accelerated production capacity scheduling in the factory in Taiwan, China, but also locked in the automotive field of new plants in Japan, Europe and other places. However, with the correction of the semiconductor economy, the main wafer foundries have more abundant capacity scheduling production of automotive chips, which makes the chip shortage improved to a certain extent, and even reached the balance between supply and demand.　　Once the construction of the European plant is delayed, the industry analysis, its European automotive chip customers may maintain in Taiwan, China, or even transfer to Japan, the United States and other places to produce new plants, which will help Taiwan Semiconductor better use of overseas plant capacity.

Key word：

Taiwan Semiconductor Manufacturing,2025

Release time：2023-02-20 17:00 reading：2956 Continue reading>>

Ameya360:<span style='color:red'>EU</span>, U.S. Making Moves to Address Ethics in AI

Trade news

Ameya360:EU, U.S. Making Moves to Address Ethics in AI

　　The United States and European Union are divided by thousands of miles of the Atlantic Ocean, and their approaches to regulating AI are just as vast. The landscapes are also dynamic, with the latest change on the U.S. side set to roll out today—about seven weeks after a big move in the EU.　　The stakes are high on both sides of the Atlantic, with repercussions in practices as disparate as determining prison sentences to picking who gets hired.　　The European Union’s Artificial Intelligence Act (AIA), which was approved by the Council of the EU on Dec. 6 and is set to be considered by the European Parliament as early as March, would regulate AI applications, products and services under a risk-based hierarchy: The higher the risk, the stricter the rule.　　If passed, the EU’s AIA would be the world’s first horizontal—across all sectors and applications—regulation of AI.　　In contrast, the U.S. has no federal law specifically to regulate the use of AI, relying instead on existing laws, blueprints, frameworks, standards and regulations that can be stitched together to guide the ethical use of AI. However, while business and government can be guided by frameworks, they are voluntary and offer no protection to consumers who are wronged when AI is used against them.　　Adding to the patchwork of federal actions, local and state governments are enacting laws to address AI bias in employment, as in New York City and the entire state of California, and insurance, with a law in Colorado. No proposed or enacted local law has appeared in the news media to address using AI in jail or prison sentencing. However, in 2016, a Wisconsin man, Eric Loomis, unsuccessfully sued the state over a six-year prison sentence that was based, in part, on AI software, according to a report in The New York Times. Loomis contended that his due process rights were violated because he could not inspect or challenge the software’s algorithm.　　“I would say we still need the foundation from the federal government,” Haniyeh Mahmoudian, global AI ethicist at DataRobot, told EE Times. “Things around privacy that pretty much every person in the United States is entitled to, that is something that the federal government should take care of.”　　The latest national guideline is expected to be released today by the National Institute of Standards and Technology (NIST).

Key word：

AI

Release time：2023-01-28 14:23 reading：2719 Continue reading>>

<span style='color:red'>EU</span> Approves $2 Billion for IoT, Connected Car Research

Trade news

EU Approves $2 Billion for IoT, Connected Car Research

　　The European Commission has cleared the use of €1.75 billion (about $2 billion) in public funds from France, Germany, Italy, and the U.K. to support an integrated project for joint research and innovation in microelectronics addressing the internet of things and connected or driverless cars.　　The clearance was necessary to ensure that the funding would be in line with EU state aid rules and contributes to a common European interest, a key condition for public support. The integrated research and innovation project will involve 29 direct participants, headquartered both in and outside the EU, carrying out 40 closely interlinked sub-projects. These direct participants will work in collaboration with wider partners, such as other research organizations or small- and medium-sized enterprises (SMEs), also beyond the four member states.　　The project’s overall objective is to enable research and develop innovative technologies, chips, and sensors that can be integrated in applications such as consumer devices, automated vehicles, commercial devices, and industrial devices, including management systems for batteries in electric mobility and energy storage. In particular, the project is expected to stimulate additional research and innovations in relation to the internet of things and to connected or driverless cars.　　The 29 participants in the microelectronics research project cleared by the European Commission.　　Participants and their partners will focus their work on five different technology areas:　　(1) Energy-efficient chips: developing new solutions to improve the energy efficiency of chips. These will, for example, reduce the overall energy consumption of electronic devices, including those installed in cars.　　(2) Power semiconductors: developing new component technologies for smart appliances as well as for electric and hybrid vehicles to increase the reliability of semiconductor devices.　　(3) Smart sensors: working on the development of new optical, motion, or magnetic field sensors with improved performance and enhanced accuracy. Smart sensors will help improve car safety through more reliable and timely reaction to allow a car to change lanes or avoid an obstacle.　　(4) Advanced optical equipment: developing more effective technologies for future high-end chips.　　(5) Compound materials: developing new compound materials (instead of silicon) and devices suitable for more advanced chips.　　The project participants will be involved in over 100 collaborations across the different areas in 40 closely interlinked sub-projects. It’s thought that in addition to the €1.75 billion funding provided by each of the four countries, the project will unlock an additional €6 billion ($6.84 billion) in private investment. The project should be completed by 2024 (with differing timelines for each sub-project).　　The idea of such funding is to enable risky and ground-breaking research and innovation whilst ensuring that its benefits are shared widely and do not distort the level playing field in Europe. The innovations supported by taxpayer money are supposed to be of benefit to European citizens as a whole.　　The European Commission says that investment in research in microelectronics at this scale is a major transnational innovation project. It carries a considerable element of risk; therefore, public support is appropriate and necessary to incentivize companies to carry out these ambitious activities. Microelectronics is considered a key enabling technology with applications in multiple industries and in helping to tackle societal challenges.　　The results of the research project will be disseminated by participating companies benefiting from public support. In this context, an annual conference on the project will be organized, the first of which will be held in November 2019. Furthermore, companies will host a series of technical events on their respective sub-projects.　　Commissioner Margrethe Vestager, in charge of competition policy, said, “Innovation in microelectronics can help the whole of Europe leap ahead in innovation. That’s why it makes sense for European governments to come together to support such important projects of common European interest if the market alone would not take the risk. And it is why we have put special state aid rules in place to smooth the way.”　　In addition, Commissioner Mariya Gabriel, in charge of digital economy and society, said, “If we don’t want to depend on others for such essential technology [microelectronics] — for example, for security or performance reasons — we have to be able to design and produce them ourselves.”　　The rules support investments for research, development and innovation, and first industrial deployment on the condition that the projects receiving this funding are highly innovative and do not cover mass production or commercial activities. They also require extensive dissemination and spillover commitments of new knowledge throughout the EU and a detailed competition assessment to minimize any undue distortions in the internal market.　　The project is unlikely to be affected by Brexit. We asked the Commission for clarification and were told that the U.K.’s withdrawal agreement would have been agreed upon at the negotiator’s level but still needs to be concluded by the EU and ratified by the U.K. before it can enter into force. There is then likely to be a transition period (which will last until the end of December 2020 unless extended). During this transition period, the entire body of EU law will continue to apply to, and in, the U.K. as if it were a member state. This includes all EU rules relating to state aid. So funding support will remain binding on and in the U.K.　　The project sets out the maximum amount of aid authorized for each of the beneficiaries, and the U.K. is expected to grant aid within these maximum amounts. Once state aid has been approved by the European Commission, member states are authorized to grant the aid and normally do so.

Key word：

IoT

Release time：2019-01-17 00:00 reading：1251 Continue reading>>

Trade news

Apple's iPhone sales warning is crushing European chip stocks, AMS dives 19%

European chip stocks tumbled on Thursday after Apple cut its first-quarter revenue guidance citing weaker-than-expected iPhone sales and slowing economic growth in China.Austrian chipmaker AMS nosedived 19 percent while Swiss firm STMicroelectronics dropped around 7 percent. Both companies are semiconductor suppliers for Apple devices.Shares of Anglo-German chip supplier Dialog Semiconductors plunged 7 percent at the open in Frankfurt. In October, Apple agreed to buy a portion of Dialog's business in a $600 million deal.Other chip stocks including Dutch firm ASM International and Germany-based Siltronic also fell at the open amid pressure in the semiconductor industry. The broader European Stoxx 600 tech index was the worst performing sector in Europe on Thursday, trading down around 2 percent.The moves in Europe followed losses in Asia's tech sector among Apple suppliers.Apple CEO Tim Cook issued a letter to investors Wednesday lowering the iPhone maker's fiscal first quarter revenue guidance to $84 billion, down from a previous range of $89 billion to $93 billion.In an interview with CNBC's Josh Lipton on Wednesday, Cook said trade tensions between the U.S. and China were one factor weighing on the tech giant's outlook.Apple shares traded down roughly 7 percent in extended hours on Thursday. Several Apple suppliers have cut their outlook in recent months citing weak demand.

Key word：

Apple

Release time：2019-01-04 00:00 reading：1288 Continue reading>>

Trade news

US has a 'concerted strategy' to push allies to reject Huawei's 5G equipment: Eurasia Group

Miquel Benitez | Getty ImagesThe United States is pushing its allies to shut out Chinese tech giant Huawei's 5G networks due to national security concerns as the high-speed technology is set to play a critical role in the 21st century, a Eurasia Group expert said Tuesday.Japan, Washington's close ally, will reportedly stop buying Huawei and ZTE network equipment for government offices and its military forces. Huawei has also been excluded from providing technology for the core 5G network that's being developed by U.K. telecoms firm BT.Australia and New Zealand have also banned Huawei from participating in building their 5G networks — the next generation of mobile technology expected to revolutionize the interaction of internet-connected devices and appliances."This is part of a concerted strategy on the part of the United States to pressure allies, western countries and other like-minded allies not to include Chinese 5G equipment in their next generation networks," Kevin Allison, director of geo-technology at risk consultancy Eurasia Group, said Tuesday on CNBC's "Squawk Box."Allison said that 5G technology is a "geopolitically consequential network upgrade" that represents a new level of innovation with major implications for a number of sectors including driverless vehicles, smart cities, advanced factories and artificial intelligence.Such technologies "are really going to set the tone for the rest of the 21st century," he said, citing intense competition in areas such as the race for faster economic growth and stronger militaries.The U.S. approach to box in Huawei is also a factor in its broader conflict with China over trade, Allison said.Complicating the tariff conflict is Canada's arrest on Dec. 1 of Meng Wanzhou, Huawei's chief financial officer and daughter of company founder Ren Zhengfei, for alleged violation of U.S. sanctions against Iran. The U.S. is seeking her extradition and hearings are ongoing in Vancouver.'Strictly complies'China has strongly criticized the treatment of Meng and summoned the ambassadors of both Canada and the U.S. to complain.Huawei, in a letter to its suppliers released late Thursday, said that it "strictly complies with all applicable laws and regulations in our global business operations" and added it "is not aware of any wrongdoing (by Meng)."Allison predicted that the U.S. effort will result in "a split between a 5G network that is built with Chinese technology in some countries, and networks that are built to be free of Chinese technology in other countries."That echoes the view of former Google top executive Eric Schmidt who said earlier this year that within the next decade there will be two separate internets: one led by the U.S. and the other by China.Key vendors in the 5G network business besides Huawei and fellow Chinese company ZTE include Sweden's Ericsson, Finland's Nokia, South Korea's Samsung, Japan's NEC and Fujitsu, as well as Intel, Qualcomm and Cisco of the United States, according to a Eurasia Group report in November.Josh Kallmer, executive vice president for policy at the Information Technology Industry Council, expressed hope for a system of rules whereby questions of security and competition can be balanced."Certainly there's no more important role for a government than to look after national security but it's also important to pursue these commercial issues in the context of a rules based environment," Kallmer told CNBC."We're confident that if both China and the United States and other markets commit to that, then companies will be able to compete on the merits that everybody will have a fair shake at succeeding — and that's the outcome we should all prefer," he said.

Key word：

5G,Huawei

Release time：2018-12-12 00:00 reading：1445 Continue reading>>

Trade news

Western European HCP Market, 3Q18: Shipments Continue to Decline But Revenues More Stable

According to research by International Data Corporation (IDC), the Western European printer and multifunction (MFP) market decreased by 6.7% in unit terms in 3Q18 compared with the same period a year ago. This was lower than expectations as the inkjet markets declined in most areas. On a more positive note the market values declined at a much lower rate of 2.1% as the market continued to transition to higher-speed devices and color A3 devices.Laser markets performed better than expected, declining by only 1.2%. Color and monochrome remained relatively stable, with color shipments showing a marginal increase and monochrome shipments only showing a small decline in terms of units with a slight increase in the value of the monochrome market. The market did, however, see the continued decline of single-function printers and an increase in MFP products, notably monochrome devices.The inkjet markets suffered the most in terms of unit growth with 3Q shipments registering a 9.0% decline even though revenues declined at a slower rate. Most inkjet OEMs are showing lower sales of inkjet devices as fewer home users have a need for printer devices as they are printing less, but business inkjets also slipped back in 3Q. The business inkjet market is showing signs of transition as higher-priced and higher-specification devices are shipping in place of entry-level models; as a result the values for business inkjets increased. It must be noted that business inkjets grew strongly.The overall production markets saw a small decline, but as with office devices there was an increase in color laser shipments and a decline in monochrome. There was also an increase in labels and packaging models that shipped."The HCP market will show an overall decline in 2018 as the market transitions away from the printed page to the digital page, but the Western Europe market remains a sizeable opportunity for many," said Phil Sargeant, program director in IDC's Western European Imaging, Hardware Devices, and Document Solutions group. "Print remains an important attribute for many companies and it's clear that there are many transitions and opportunities that remain in areas such as color, ink, and even monochrome. Those suppliers utilizing their IT services, security, and environmental policies are seeing some success as a result."Main highlights:• The overall Western European hardcopy market contracted by 6.7% year on year in 3Q18, recording a shipment figure of 4.8 million units.• The main area of growth was in A3 business inkjets, an area that many OEMs are now beginning to focus more on.• In the laser markets overall color showed slight growth and though monochrome overall declined there was strong demand for A4 MFP products.• 85% of all hardcopy shipments are now from MFP products, an increase from the same period a year ago and from the previous quarter of 2Q18.

Key word：

Market trend

Release time：2018-11-19 00:00 reading：1122 Continue reading>>

model	brand	Quote
RB751G-40T2R	ROHM Semiconductor
BD71847AMWV-E2	ROHM Semiconductor
MC33074DR2G	onsemi
CDZVT2R20B	ROHM Semiconductor
TL431ACLPR	Texas Instruments

model	brand	To snap up
IPZ40N04S5L4R8ATMA1	Infineon Technologies
STM32F429IGT6	STMicroelectronics
BP3621	ROHM Semiconductor
BU33JA2MNVX-CTL	ROHM Semiconductor
TPS63050YFFR	Texas Instruments
ESR03EZPJ151	ROHM Semiconductor

PART	Quantity*	Target Price
	Quantity MOQ: 1	Target Price $ If not sure, you may skip this
remark

Telephone *	Name
Company
Email